R面（1-102）蓝宝石晶片是用于微电子IC应用中硅的异质外延沉积的优选材料。R面是蓝宝石的非极性面。因此，R面在蓝宝石器件中的位置不同，蓝宝石器件的力学、热学、电学和光学性能都会发生很大的变化，这也会影响蓝宝石器件的后续加工性能、加工效率和加工成品率。
为了使蓝宝石晶棒和后续蓝宝石产品的晶体结构一致，更常用的方法是在蓝宝石晶棒上加工一个A方向的表面作为蓝宝石晶片（后续蓝宝石产品）的平面取向，使蓝宝石晶棒和晶片的R方向位置一致。
| Item | 2 -inch R-plane(1-102) 430μm Sapphire Wafers | |
| Crystal Materials | 99,999%, High Purity, Monocrystalline Al2O3 | |
| Grade | Prime, Epi-Ready | |
| Surface Orientation | R-plane(1-102) | |
| Diameter | 50.8 mm +/- 0.1 mm | |
| Thickness | 430 μm +/- 25 μm | |
| Primary Flat Orientation | 45 +/- 1deg. counter-clockwise from C-axis projection on R-plane | |
| Primary Flat Length | 16.0 mm +/- 1.0 mm | |
| Single Side Polished | Front Surface | Epi-polished, Ra < 0.5 nm (by AFM) |
| (SSP) | Back Surface | Fine ground, Ra = 0.8 μm to 1.2 μm |
| Double Side Polished | Front Surface | Epi-polished, Ra < 0.5 nm (by AFM) |
| (DSP) | Back Surface | Epi-polished, Ra < 0.5 nm (by AFM) |
| TTV | < 10 μm | |
| BOW | < 10 μm | |
| WARP | < 10 μm | |
| Cleaning / Packaging | Class 100 cleanroom cleaning and vacuum packaging, | |
| 25 pieces in one cassette packaging or single piece packaging. | ||
注：可提供任意晶向和厚度的定制化蓝宝石晶片。
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