凭借多年丰富的生产经验,我们可以生产高质量的任意晶向、抛光或不抛光的蓝宝石晶片。通过我们的抛光工艺可以减小蓝宝石晶片的厚度,从而获得所需的厚度、以及更好的TTV和更低的表面粗糙度。
特殊晶向、带或者不带定位边都可依据客户的要求来定制生产。对于1英寸C面(0001)蓝宝石晶片,我们通常提供不带定位边的圆形晶片。
Item | 1-inch C-plane(0001) 430μm Sapphire Wafers | |
Crystal Materials | 99,999%, High Purity, Monocrystalline Al2O3 | |
Grade | Prime, Epi-Ready | |
Surface Orientation | C-plane(0001) | |
C-plane off-angle toward M-axis 0.2 +/- 0.1° | ||
Diameter | 25.4 mm +/- 0.1 mm | |
Thickness | 430 μm +/- 25 μm | |
Single Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
(SSP) | Back Surface | Fine ground, Ra = 0.8 μm to 1.2 μm |
Double Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
(DSP) | Back Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
TTV | < 5 μm | |
BOW | < 5 μm | |
WARP | < 5 μm | |
Cleaning / Packaging | Class 100 cleanroom cleaning and vacuum packaging, | |
25 pieces in one cassette packaging or single piece packaging. |
注:可依据客户需求定制生产任意晶向、厚度蓝宝石晶片。